Correct, if all circuits that present in the room are protected by
RCD(s) with a trip of no more than 30mA *and* the main equipotential
binding is in place and to an adequate standard, then supplementary
bonding is not required.
Main equipotential bonding is in place ( I redid it a few years ago),
though I guess I'm not in a position to easily confirm the quality of
the main earth (TT system).
Though thinking about it some more the only thing directly connected to
the copper pipe is the rad, everything else is plumbed in plastic (at
least the final runs anyway)
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