When I attempt to execute a join with a solder ring fitting I'm finding that I generally get small gaps in the solder ring when it soldifies. However, whilst the solder is liquid I do achieve a solid ring, some of which seems to be sucked back inside the joint on cooling to form the gaps. I've dissasembled numerous samples of my countless "failed" test joints (I though soldered fittings were supposed to work out cheeper ;) ) and both the pipe and the fitting are nicely coated in solder. From information I've got from previous postings to this group I understand I should be able to consistently achieve a solid ring of solder, otherwise my joint is suspect. Is this corrent ? If so, I've followed all the advice I could find from previous posts about solder ring joints. i.e.
- cut pipe ends square with a pipe cutter
- clean the pipe and fitting until shiny with wire wool
- apply flux to both
- heat the joint evenly with a powerful torch until you can see a ring of solder
- don't move the joint for a bit ... and was wondering if anyone could suggest what I'm doing wrong?
Thanks
-Neil