There is a fundamental problem with conventional epoxy cements for
metals, namely, a huge difference in coefficient of thermal expansion.
By using copper powder as a filler. the situation is somewhat
improved, but such a bond in a hot water system would be subjected to
hundreds of cooling-heating cycles each of which will stress the
joint. It therefore makes sense to use adhesives where they can be
monitored and where an inadvertant leak will not cause a
major ,problem. Also, the integrity of the bond is even more dependent
on clean surfaces than soldering. As always, let the process and the
materials be dictated by the needed results. HTH
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