When I used to do that, we potted the "test" units up with a removable potting compound (silicone rather than filled epoxy, AFAIR). Although the units were sealed well enough to survive in service (chemical splash more than impact), it was still possible to re-open them afterwards with a scalpel and peel them out. Then they'd often have small changes made (hybrid circuits manually de-soldered, swapped and re-soldered), potted up again and would go back into service.